issue 1 C october, 2011 www.diodes.com ? diodes incorporated, 2011 ZXGD3104EV2 user guide introduction the purpose of this board is to demonstrate the drivi ng of a synchronous mosfet as a schottky replacement in isolated power supplies. the circuit is sui table for use in ac/dc flyback converters. end applications include external power adaptors for laptops greater than 90w, and led monitors. when used to drive a low on-resistance mosfet, the boa rd increases power efficiency whilst still maintaining simplicity of design. performance recommended supply voltage vin: 19v gate voltage clamped to 12v maximum ideal for quasi resonant operation switching frequency up to 250khz ordering information order number ZXGD3104EV2 caution: do not connect the evaluation board to a supply voltage, vin, greater than 25v! figure 1. evaluation board layout
ZXGD3104EV2 issue 1 C october, 2011 www.diodes.com ? diodes incorporated 2011 2 evaluation guide there are two possible test setups for the evaluation board. the preferred setup is low side synchronous rectification (see figure 2b), due to the ease of acquiring the supply voltage to the board directly from the output of the power supply. the oth er option is shown in figure 3a. figure 3a shows the board driving a mosfet for high side rectificatio n. low side synchronous rectification 1. remove the original schottky from the power suppl y 2. apply a short across the schottkys k and a terminal s 3. cut the track that connects the negative terminal of the output filter capacitor to the output of the transformer winding. 4. insert a low on-resistance mosfet between the cut tr acks. the drain terminal of the mosfet should be connected to the output of the transf ormer winding, whilst the source terminal is connected to the output capacitor. caution: the mosfet breakdown must be higher than t he maximum drain-source voltage spike, plus a 10% to 30% margin. 5. connect the power supplys output voltage, 19v, to the terminal block p1 (see figure 2b). 6. connect an ac voltage source to the power supplys i nput. 7. turn on the ac voltage source and measure the effici ency. high side synchronous rectification 8. remove the original schottky from the power suppl y 9. insert a low on-resistance mosfet to replace the s chottky. the source terminal of the mosfet should be connected to the output of the transf ormer winding, whilst the drain terminal should be connected to the output capacitor 10. connect a 10v auxiliary supply to terminal block p 1 (see figure 2a). 11. connect an ac voltage source voltage to the power s upplys input. 12. turn on the power supply and measure the efficien cy. (a) (b) figure 2: test options for evaluation board a) high side rectification and b) low side rectification
ZXGD3104EV2 issue 1 C october, 2011 www.diodes.com ? diodes incorporated 2011 3 conditioning the power supply to maximize efficienc y any stray inductance in the load current path may cause distortion of the drain-to-source voltage waveform, leading to premature turn-off of the sync hronous mosfet. in order to avoid this issue, drain voltage sensing should be done as physically clo se to the drain terminals as possible. the pcb track length between the drain pin and the mosfets t erminal should be kept to less than 10mm. mosfet packages with a low internal wire-bond inductan ce are preferred for high switching frequency power conversion, to minimize body-diode co nduction. after the primary mosfet turns off, its drain voltage oscillates due to the reverse recovery of the snubber diode. these high frequency oscillations are reflected into the transformer secondary winding and the drain terminal of the synchronous mosfet. the synchronous ic senses the drain voltage ringing, causing its gate output voltage to oscillate. the synchronous mosfet cannot be fully enhanced until the drain voltage stabilizes. in order to prevent this issue, the oscillations on th e primary mosfet can be damped with either a series resistor rd to the snubber diode dsnub, or an r-c network across dsnub as shown in figure 3. both methods reduce the oscillations by softening t he snubber diodes reverse recovery characteristic. figure 3: techniques to prevent/reduce gate voltage oscillations
ZXGD3104EV2 issue 1 C october, 2011 www.diodes.com ? diodes incorporated 2011 4 waveform and efficiency measurements the operating waveforms of the controller can be measu red using oscilloscope probes. if a current probe or transformer is also used to measure the mosf et current, the wire length should be kept short to avoid excessive loop-inductance which could dist urb the controller operation. figure 4 shows the operating waveforms in the flyback converter inside a 19v 90w output power adaptor. the power adaptor also incorporates a boost power factor correction stage to comply with iec61000-3-2. the controller senses the forward voltage drop of the parasitic diode within the mosfet, and when the diode is in conduction, applies a voltage to the mosfet gate, turning on the mosfet after an initial delay time. the gate output voltage of the co ntroller is then proportional to the sensed voltage. in qr mode, the gate voltage is reduced as the mosfe ts drain current decreases. this ensures that the mosfet is turned off at the zero current poi nt, with little or no reverse current. another advantage is that this technique prevents early termin ation of the gate voltage at low drain current. early termination of gate voltage can reduce the effic iency due to body-diode conduction loss. figure 5 shows that 90% efficiency can be achieved in the 90w adaptor when using the evaluation board to drive a 10m 100v synchronous mosfet. figure 4: operating waveforms in qr mode with a 10m 100v synchronous mosfet figure 5: efficiency measurement in a 19v 90w power adaptor
ZXGD3104EV2 issue 1 C october, 2011 www.diodes.com ? diodes incorporated 2011 5 board schematic figure 6 shows the circuit schematic of ZXGD3104EV2. po wer for the controller is applied to the terminal block p1. a three way header, p2 is located at the other end of the board. the header allows the board to be soldered directly across a synchronous mosfet in a to220 package. the board can also be used with an smd mosfet by connecting the pin- outs accordingly. the evaluation board is designed to accept a supply voltage of 19v, which is the typical output voltage of a laptop power adaptor. if the power suppl ys output voltage is required to be greater than 25v, a voltage regulator should be used to step down t he high voltage to 19v before connecting to the evaluation board. the values of the threshold setting resistors, rref and rbias, are chosen for vcc=19v. please refer to the zxgd3105n8 datasheet for m ore information. dz is an optional zener diode connected to the bias pin of the controller to limit the maximum gate voltage to 12v. dz is recommended when the controller is used to drive a high-gate-charge synchronous mosfet or/and at high switching frequency. this configuration reduces the gate-charge switching loss. figure 6: circuit diagram please note that the component part numbers are give n as a guide only. due to continual component development, all parts quoted should be checked for suita bility and availability with their respective manufacturers. table 1: part list ref. value package part number manufacturer notes u1 25v vcc max synchronous controller so8 zxgd3104n8 diodes inc. dz 12v zener sot23 bzx84c12 diodes inc. c1 1uf 50v capacitor 1206 c1206x105k5r kemet x7r p1 2-way terminal generic p2 3-way header generic rbias 6k2 resistor 1206 generic 1%, 200ppm/oc rgate 0r resistor 1206 generic 5%, 200ppm/oc rref 8k2 resistor 1206 generic 1%, 200ppm/oc
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ZXGD3104EV2 issue 1 C october, 2011 www.diodes.com ? diodes incorporated 2011 8 important notice diodes incorporated makes no warranty of any kind, express or implied, with regarding to this document, including, but not limited to, the implied w arranties of merchantability and fitness for a particular purpose (and their equivalents under the l aws of any jurisdiction). diodes incorporated and its subsidiaries reserve th e right to make modifications, enhancements, improv ements, corrections or other changes without further notice to this docume nt and any product described herein. diodes incorpo rated does not assume any liability arising out of the application or use of this document or any product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any cu stomer or user of this document or products described herein in such appli cations shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products a re represented on diodes incorporated website, harm less against all damages. diodes incorporated does not warrant or accept any liability whatsoever in respect of any products pur chased through unauthorized sales channel. should customers purchase or use diodes incorporated products for any unintended or unauthorized applic ation, customers shall indemnify and hold diodes incorporated and it s representatives harmless against all claims, dama ges, expenses, and attorney fees arising out of, directly or indirectl y, any claim of personal injury or death associated with such unintended or unauthorized application. products described herein may be covered by one or m ore united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or for eign trademarks. life support diodes incorporated products are specifically not a uthorized for use as critical components in life su pport devices or systems without the express written approval of the chief ex ecutive officer of diodes incorporated. as used here in: a. life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to per form when properly used in accordance with instruct ions for use provided in the labeling can be reasonably ex pected to result in significant injury to the user. b. a critical component is any component in a life support device or system whose failure to perform c an be reasonably expected to cause the failure of the life su pport device or to affect its safety or effectivene ss. customers represent that they have all necessary ex pertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulato ry and safety-related requirements concerning their products and any use of diodes incorporated products in such safety-crit ical, life support devices or systems, notwithstanding any devices- or systems -related information or support that may be provide d by diodes incorporated. further, customers must fully indemn ify diodes incorporated and its representatives aga inst any damages arising out of the use of diodes incorporated produ cts in such safety-critical, life support devices o r systems. copyright ? 2011, diodes incorporated www.diodes.com sales offices the americas 3050 e. hillcrest drive westlake village, ca 91362-3154 tel: (+1) 805 446 4800 fax: (+1) 805 446 4850 europe kustermannpark balanstra?e 59, d-81541 mnchen germany tel: (+49) 894 549 490 fax: (+49) 894 549 4949 taiwan 7f, no. 50, min chuan road hsin-tien taipei, taiwan tel: (+886) 289 146 000 fax: (+886) 289 146 639 shanghai rm. 606, no.1158 changning road shanghai, china tel: (+86) 215 241 4882 fax (+86) 215 241 4891 shenzhen room a1103-04, anlian plaza, #4018 jintian road futian cbd, shenzhen, china tel: (+86) 755 882 849 88 fax: (+86) 755 882 849 99 korea 6 floor, changhwa b/d, 1005-5 yeongtong-dong, yeongtong-gu, suwon-si, gyeonggi-do, korea 443-813 tel: (+82) 312 731 884 fax: (+82) 312 731 885
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